Electronic device

ABSTRACT

An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

CROSS REFERENCE TO RELATED APPLICATION

This application claims the benefits of the Chinese Patent ApplicationSerial Number 202010185773.7, filed on Mar. 17, 2020, the subject matterof which is incorporated herein by reference.

BACKGROUND 1. Field of the Disclosure

The present disclosure relates to an electronic device. Morespecifically, the present disclosure relates to an electronic devicewith a flexible circuit structure.

2. Description of Related Art

With the development of electronic products toward narrow borders, it isadvantageous in using flexible printed circuit (FPC) boards to connectelectronic components. For example, the ability to provide a largerdisplay area is one of the key factors that affect consumers' purchaseintentions. The reason why the display devices of a new generation cansuccessfully achieve a borderless design is to use FPC to electricallyconnect the peripheral driver chips, so that the driver chips that areoriginally arranged on the periphery of the display panel can thus bearranged on the back side of the display panel, so as to maximize thedisplay area of the display panel.

However, due to the poor adhesion between the polyimide film of the FPCand the metal pads and the adhesive, it is likely to encounter thepeeling problems. Therefore, it is desired to provide an electronicdevice to improve or eliminate the aforementioned problems.

SUMMARY

The present disclosure provides an electronic device characterized byincluding a flexible circuit structure. The flexible circuit structureincludes a flexible substrate and an insulator, wherein the flexiblesubstrate has a surface on which a plurality of pads are disposed, andthe insulator is arranged on the flexible substrate and between twoadjacent pads of the plurality of pads.

Other novel features of the disclosure will become more apparent fromthe following detailed description when taken in conjunction with theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of an electronic device according to anembodiment of the present disclosure;

FIG. 2 is a partial cross-sectional view of an electronic deviceaccording to an embodiment of the present disclosure;

FIG. 3 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure;

FIG. 4 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure;

FIG. 5 is a partial cross-sectional view of an electronic deviceaccording to another embodiment t of the present disclosure;

FIG. 6 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure; and

FIG. 7 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure.

DETAILED DESCRIPTION OF EMBODIMENT

The implementation of the present disclosure is illustrated by specificembodiments to enable persons skilled in the art to easily understandthe other advantages and effects of the present disclosure by referringto the disclosure contained therein. The present disclosure isimplemented or applied by other different, specific embodiments. Variousmodifications and changes can be made in accordance with differentviewpoints and applications to details disclosed herein withoutdeparting from the spirit of the present disclosure.

It should be noted that, in the present specification, when a componentis described to comprise an element, it means that the component maycomprise one or more of the elements, and it does not mean that thecomponent has only one of the element, except otherwise specified.

Ordinal numbers, such as “first” and “second”, used herein are intendedto distinguish components rather than disclose explicitly or implicitlythat names of the components bear the wording of the ordinal numbers.The ordinal numbers do not imply what order a component and anothercomponent are in terms of space, time or steps of a manufacturingmethod. The ordinal numbers are only intended to distinguish a componentwith a name from another component with the same name.

In addition, the term “on” used herein may refer to two components indirect contact with each other or refer to two components not in directcontact with each other.

In addition, the term “adjacent” used herein may refer to describemutual proximity and does not necessarily mean mutual contact.

In addition, the term “connect” is intended not only directly connectwith other element, but also intended indirectly connect andelectrically connect with other element.

In addition, the technical features of the different embodimentsdisclosed in the present disclosure can be combined to form anotherembodiment.

In addition, the electronic device disclosed in the present disclosuremay include a display device, an antenna device, a sensing device, atouch display device, a curved display device, or a free shape displaydevice, but is not limited thereto. The electronic device may be abendable or flexible electronic device. The electronic device mayinclude, for example, liquid crystal, light emitting diode,fluorescence, phosphor, other suitable display media, or a combinationthereof, but is not limited thereto. The light emitting diode mayinclude, for example, an organic light emitting diode (OLED), asub-millimeter light emitting diode (mini LED), a micro light emittingdiode (micro LED) or a quantum dot (QD) light emitting diode (forexample, QLED, QDLED) or other suitable materials or a combinationthereof, but is not limited thereto. The display device may include, forexample, a tiled display device, but is not limited thereto. The antennadevice may be, for example, a liquid crystal antenna, but is not limitedthereto. The antenna device may include, for example, a tiled antennadevice, but is not limited thereto. It should be noted that theelectronic device may be a combination of the foregoing, but is notlimited thereto. In addition, the appearance of the electronic devicemay be rectangular, circular, polygonal, a shape with curved edges, orother suitable shapes. The electronic device may have peripheral systemssuch as a driving system, a control system, a light source system, ashelf system, etc., to support a display device, an antenna device, or atiled device. Hereinafter, the display device will be used as anelectronic device for illustrative purpose only, but the disclosure isnot limited thereto.

FIG. 1 is a schematic view of an electronic device according to anembodiment of the present disclosure. As shown in FIG. 1, the electronicdevice of this embodiment includes: a flexible circuit structure 10, asubstrate 20, and a circuit board 30. The flexible circuit structure 10has a signal transmission function, and can be connected to thesubstrate 20 and the circuit board 30, respectively, for transmittingsignals between the substrate 20 and the circuit board 30 (for example,gate signals or source signals). However, the present disclosure is notlimited to this. The connection structure between the flexible circuitstructure 10 and the substrate 20 will be described in detail below asan example.

The substrate 20 can be used for a display device, an antenna device, asensing device or a tiled device. The substrate 20 may be provided withan active component, and the active component may include a transistor.The substrate 20 may be a flexible substrate or a non-flexiblesubstrate, and the material of the substrate 20 may include, forexample, glass, quartz, wafer, sapphire substrate, polycarbonate (PC),polyimide (PI), polypropylene (PP), polyethylene terephthalate (PET),other suitable materials, or a combination thereof. However, the presentdisclosure is not limited to this.

In this embodiment, the substrate 20 includes a display area 21 and anon-display area 22. The non-display area 22 is disposed beside thedisplay area 21, and the non-display area 22 is electrically connectedto the flexible circuit structure 10. FIG. 2 is a partialcross-sectional view taking along the line A-A′ in FIG. 1. As shown inFIG. 2, the flexible circuit structure 10 includes a flexible substrate11 and an insulator, which is an insulating layer 121 in FIG. 2. Theflexible substrate 11 has a surface 110 on which a plurality of firstpads 111 are disposed. The insulator is disposed on the flexiblesubstrate 11, and is disposed between two adjacent first pads 111 of theplurality of first pads 111.

The material of the flexible substrate 11 may include, for example,polyimide (PI), polycarbonate (PC), polypropylene (PP), polyethyleneterephthalate (PET), polyethylene naphthalate (PEN), acrylic, othersuitable materials, or a combination thereof. However, the presentdisclosure is not limited to this.

The flexible circuit structure 10 may have a circuit fabricated on theflexible substrate 11, and the fabricating process may include, forexample, a printing process, a chemical vapor deposition (CVD) process,a lithography process, an etching process, and so on. However, thepresent disclosure is not limited to this. In addition, the first pad111 is a conductive material, which may include, for example, a metalmaterial, such as Au, Cu, Ni, Ag, Ti, Cr, Mo or Al, an alloy material, aconductive metal oxide, other suitable materials, or a combinationthereof. However, the present disclosure is not limited to this.

On the flexible substrate 11 of the flexible circuit structure 10, theremay be provided active components such as driving chips, or passivecomponents such as resistors, capacitors or inductors. In someembodiments, the flexible substrate 11 of the flexible circuit structure10 may be provided with a driving chip. The driving chip is electricallyconnected to the circuit board 30 and the first pads 111, and the firstpads 111 are electrically connected to the conductive circuit of thesubstrate 20, so that the driving chip is capable of receiving thesignals from the circuit board 30 and then transmitting the signals tothe substrate 20 through the first pads 111. However, the presentdisclosure is not limited to this.

The material of the insulator may include non-conductive materials. Forexample, the insulator may include a polymer material, a silicon oxidecompound, a silicon nitride compound, a silicon nitride oxide compound,other suitable materials, or a combination thereof. For example, thepolymer material may include polyimide (PI), polyethylene (PE),polyethylene terephthalate (PET), polyamide, other suitable materials,or a combination thereof. The silicon oxide compound may include silicondioxide. The silicon nitride compound may contain Si₃N₄. The siliconnitride oxide compound may contain Si₂N₂O. In this embodiment, thematerial of the insulator is Si₃N₄. However, the present disclosure isnot limited to this.

The shape of the insulator may be a layered shape, columnar shape,tapered shape, or other suitable shapes, or a combination thereof. Insome embodiments, the insulator may be disposed between any two adjacentfirst pads 111 or on the surface 110 between any two adjacent first pads111. In some embodiments, the insulator may be disposed at intervalsbetween two adjacent first pads 111 or on the surface 110 between twoadjacent first pads 111. In this embodiment, the insulator includes aninsulating layer 121, and the insulating layer 121 is disposed on thesurface 110 between two adjacent first pads 111. However, the presentdisclosure is not limited to this.

When flatten the flexible substrate 11, the flexible substrate 11extends substantially along the first direction. The normal direction Nof the flexible substrate 11 is substantially perpendicular to the firstdirection. The angle between the first direction and the normaldirection N is between 80 degrees and 100 degrees. The insulating layer121 has a first maximum height H1 in the normal direction N of theflexible substrate 11, and each of the plurality of first pads 111 has asecond maximum height H2 in the normal direction N of the flexiblesubstrate 11 respectively, wherein the first maximum height H1 may beless than or equal to the second maximum height H2. In this embodiment,the first maximum height H1 is less than the second maximum height H2,but the present disclosure is not limited thereto. The first maximumheight H1 may be, for example, between 0.1 μm and 10 μm, between 0.1 μmand 6 μm, between 0.1 μm and 3 μm, or between 0.1 μm and 2 μm. As thefirst maximum height H1 is getting less and less, it is easier tomaintain the flexibility of the flexible circuit structure. The secondmaximum height H2 may be, for example, between 0.6 μm and 12 μm, between0.6 μm and 10 μm, between 0.6 μm and 8 μm, between 0.6 μm and 5 μm,between 0.6 μm and 3 μm or between 0.6 μm to 2 μm. However, the presentdisclosure is not limited to this.

In some embodiment, the insulating layer has a first maximum height in anormal direction of the flexible substrate, and one of the plurality ofpads has a second maximum height in the normal direction of the flexiblesubstrate, where the first maximum height is less than or equal to thesecond maximum height.

In some embodiments, the electronic device includes a conductiveadhesive 40 between the flexible circuit structure 10 and the substrate20. The flexible circuit structure 10 and the substrate 20 areelectrically connected through the conductive adhesive 40, wherein theinsulating layer 121 is disposed between the flexible substrate 11 andthe conductive adhesive 40. The conductive adhesive 40 may include abinder 41 and a plurality of conductive particles 42 dispersed in thebinder 41, wherein the binder 41 may include a resin adhesive withmoisture-proof, heat-resistant, adhesion and insulating functions, suchas epoxy resin or polyimide, etc. The conductive particles 42 mayinclude gold ball particles, such as gold ball particles with a plasticsphere in the center and a nickel layer and a gold layer sequentiallycoated on the surface of the plastic sphere. The conductive adhesive 40may include an anisotropic conductive adhesive or an anisotropicconductive film (ACF). However, the present disclosure is not limited tothis.

In some embodiments, the flexible circuit structure 10 does not have apixel unit and therefore does not have a display function, while thedisplay area 21 of the substrate 20 may include a plurality of thin filmtransistors and a plurality of pixel units to display images. In someembodiments, the non-display area 22 of the substrate 20 may have aplurality of second pads 221, and the second pads 221 may berespectively electrically connected to the thin film transistors or thepixel units. In addition, the second pad 221 may be a conductivematerial, for example, including metal materials (such as Au, Cu, Ni,Ag, Ti, Cr, Mo or Al), alloy materials, conductive metal oxides (such asITO, IZO, ITZO, IGZO or AZO), other suitable materials, or a combinationthereof. In addition, the thickness of the second pad 221 may be between0.2 μm and 1.4 μm, between 0.2 μm and 1.2 μm, between 0.2 μm and 1 μm,between 0.2 μm and 0.8 μm, or between 0.2 μm and 0.4 μm. However, thepresent disclosure is not limited to this.

In some embodiments, the conductive adhesive 40 may be placed on theflexible substrate 11 of the flexible circuit structure 10. For example,the conductive adhesive 40 is placed on the first pad 111 and theinsulating layer 121. Then, the substrate 20 is aligned and placed onthe conductive adhesive 40, and subsequently the flexible circuitstructure 10 and the substrate 20 are pressed together so that theflexible circuit structure 10 and the substrate 20 are fixed to eachother. As a result, the conductive particles 42 in the conductiveadhesive 40 can be electrically connected to the first pad 111 and thesecond pad 221, so that signals can be transmitted to the substrate 20and inputted to the plurality of pixel units. However, the presentdisclosure is not limited to this.

In this embodiment, the adhering strength of the conductive adhesive 40to the insulating layer 121 is better than the adhering strength of theconductive adhesive 40 to the flexible substrate 11, so that theadhesion between the flexible circuit structure 10 and the conductiveadhesive 40 can be improved. In addition, the flexible circuit structure10 and the substrate 20 can be connected through the conductive adhesive40, so as to enhance the adhering strength between the flexible circuitstructure 10 and the substrate 20, thereby improving the productreliability of the electronic device.

FIG. 3 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure. Theelectronic device of this embodiment is similar to that disclosed inFIG. 2 except for the following differences.

In this embodiment, each of the plurality of first pads 111 has acontact surface 1111 and two side surfaces 1112, 1113, and the contactsurface 1111 is opposite to the surface 110. The contact surface 1111 isprovided between the two side surfaces 1112, 1113, and is connected tothe two side surfaces 1112, 1113. In this embodiment, the insulatorincludes an insulating layer 122, and the insulating layer 122 isdisposed on the surface 110 between two adjacent first pads 111 and onthe two side surfaces 1112, 1113 of the first pad 111. In someembodiments, the insulating layer 122 may be disposed on a partialsurface of the surface 110 between two adjacent first pads 111, andextend to a partial surface of one or both of the two side surfaces1112, 1113 of the first pad 111. In some embodiments, the insulatinglayer 122 may be disposed on a partial surface of one or both of the twoside surfaces 1112, 1113 of the first pad 111.

The insulating layer 122 has a first maximum height H1 in the normaldirection N of the flexible substrate 11, and each of the plurality offirst pads 111 has a second maximum height H2 in the normal direction Nof the flexible substrate 11 respectively, wherein the first maximumheight H1 may be less than or equal to the second maximum height H2.

In some embodiments, the insulating layer has a first maximum height ina normal direction of the flexible substrate, and one of the pluralityof pads has a second maximum height in the normal direction of theflexible substrate, where the first maximum height is less than or equalto the second maximum height.

The same or similar components in FIG. 3 and FIG. 2 will be given thesame or similar reference numerals, and the description for thosecomponents will be omitted. In this embodiment, the conductive adhesive40 may be disposed on the first pad 111 and the insulating layer 122 ofthe flexible circuit structure 10, and the conductive adhesive 40 isdisposed between the flexible circuit structure 10 and the substrate 20,wherein the binder 41 of the conductive adhesive 40 may be adhered tothe insulating layer 122 on the surface 110 and the substrate 20,respectively, and the conductive particles 42 in the conductive adhesive40 may be electrically connected to the first pad 111 and the second pad221.

In this embodiment, since the adhering strength of the conductiveadhesive 40 to the insulating layer 122 is better than the adheringstrength of the conductive adhesive 40 to the flexible substrate 11, theflexible circuit structure 10 and the substrate 20 can be connectedthrough the conductive adhesive 40 to improve the adhesion between theflexible circuit structure 10 and the conductive adhesive 40, therebyfurther enhancing the adhering strength between the flexible circuitstructure 10 and the substrate 20. In addition, due to the density ofthe high-resolution pads being getting higher and higher, the distancebetween the pads becomes less. In the design of the present disclosure,the insulating layer 122 extends from the surface of the flexiblesubstrate 11 to the side surfaces 1112, 1113 of the first pad so as toavoid the short circuit problem caused by the distance between twoadjacent first pads 111 being too small or the density of the conductiveparticles 42 being too high, thereby improving the product reliabilityof the electronic device.

FIG. 4 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure. Theelectronic device of this embodiment is similar to that disclosed inFIG. 2 except for the following differences.

In this embodiment, the insulator includes an insulating column 123. Theinsulating column 123 is disposed on the surface 110 of the flexiblesubstrate 11, and is disposed between two adjacent first pads 111. Theconductive adhesive 40 is disposed on the surface 110, the insulatingcolumn 123, and the first pad 111, and the conductive adhesive 40 isdisposed between the flexible circuit structure 10 and the substrate 20,wherein the binder 41 in the conductive adhesive 40 can be adhered tothe surface 110, the insulating column 123 and the substrate 20,respectively, and the conductive particles 42 in the conductive adhesive40 can electrically connect the first pad 111 and the second pad 221. Inthis embodiment, the insulating column 123 can also separate theconductive particles 42 between the first pads 111 to avoid a shortcircuit between the first pads 111. In the normal direction N of theflexible substrate 11, the insulating column 123 has a third maximumheight H3, and the third maximum height H3 may be less than or equal tothe second maximum height H2 of the first pad 111. However, the presentdisclosure is not limited to this.

In this embodiment, the insulating column 123 can increase the contactarea of the conductive adhesive 40 and the flexible circuit structure10, and the adhering strength of the conductive adhesive 40 to theinsulating column 123 is better than the adhering strength of theconductive adhesive 40 to the flexible substrate 11, so as to improvethe adhesion of the conductive adhesive 40 to the flexible circuitstructure 10, thereby enhancing the product reliability of theelectronic device.

FIG. 5 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure. Theelectronic device of this embodiment is similar to that disclosed inFIG. 4, except for the following differences.

In this embodiment, the insulator includes an insulating column 124, andthe insulating column 124 is disposed on the surface 110 of the flexiblesubstrate 11 and is disposed between two adjacent first pads 111. In thenormal direction N of the flexible substrate 11, the insulating column124 has a third maximum height H3, and the third maximum height H3 isgreater than the second maximum height H2 of the first pad 111. When theflexible substrate 11 is subject to severe sinking and deformation, arebounding force will be generated, resulting in that the flexiblesubstrate 11 and the conductive adhesive 40 are peeled off. With theinsulating column 124, a supporting force can be provided during theprocess of pressing the flexible substrate 11 and the substrate 20 so asto prevent the flexible substrate 11 from sinking and deformation or toprevent the conductive particles 42 from being excessively deformed.

In addition, in this embodiment, the conductive particles 42 in theconductive adhesive 40 have an average particle diameter Ro before beingpressed, and the third maximum height H3 is less than the sum of thesecond maximum height H2 and the average particle diameter Ro, so as toprevent the insulating column 124 from hindering the pressing of theflexible substrate 11 and the substrate 20. In the process of pressingthe flexible substrate 11 and the substrate 20, the amount ofdeformation of the conductive particle 42 between the first pad 111 andthe second pad 221 is 30%-70%, that is, after being pressed, the pressedparticle diameter Rd of the conductive particle 42 is 30%-70% of theaverage particle diameter Ro. In some embodiments, the amount ofdeformation of the conductive particle 42 between the first pad 111 andthe second pad 221 may be between 30%-70%, 30%-60% or 30%-50%. If theconductive particle 42 is excessively pressed, the conductive particle42 will be damaged, and thus the amount of deformation of the conductiveparticle 42 should not be too large. Therefore, the third maximum heightH3 may be between the second maximum height H2 and the sum of the secondmaximum height H2 and 30%-70% of the average particle diameter Ro. Inthis embodiment, the average particle diameter Ro can be between 0.3 μmand 7 μm, between 0.3 μm and 5 μm, between 0.3 μm and 4 μm, between 0.3μm and 3 μm, or between 0.3 μm to 2 μm. However, the present disclosureis not limited to this.

In this embodiment, the insulating column 124 not only provides asupporting force during the pressing process to prevent the flexiblesubstrate 11 from sinking and deformation or to prevent the conductiveparticles 42 from being excessively deformed, but also increases thecontact area between the conductive adhesive 40 and the flexible circuitstructure 10. Furthermore, the adhering strength of the conductiveadhesive 40 to the insulating column 124 is better than that of theconductive adhesive 40 to the flexible substrate 11, which can improvethe adhesion of the conductive adhesive 40 to the flexible circuitstructure 10, thereby enhancing the product reliability of theelectronic device.

FIG. 6 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure. Theelectronic device of this embodiment is similar to that disclosed inFIG. 2 or FIG. 5, except for the following differences.

In this embodiment, the insulator includes an insulating layer 125similar to that shown in FIG. 2 and an insulating column 126 similar tothat shown in FIG. 5. The insulating layer 125 is disposed on all of thesurface 110 between two adjacent first pads 111. The insulating column126 is disposed on the insulating layer 125 and between two adjacentfirst pads 111. The conductive adhesive 40 is disposed on the insulatinglayer 125, the insulating columns 126, and the first pads 111. Theconductive adhesive 40 is disposed between the flexible circuitstructure 10 and the substrate 20, wherein the binder 41 in theconductive adhesive 40 can be adhered to the insulating layer 125, theinsulating column 126 and the substrate 20, respectively, and theconductive particles 42 in the conductive adhesive 40 can electricallyconnect the first pad 111 and the second pad 221. However, the presentdisclosure is not limited to this. In some embodiments, the insulatinglayer 125 and the insulating columns 126 can be manufactured in the sameprocess. In some embodiments, the insulating layer 125 and theinsulating columns 126 can be manufactured in different processes. Theinsulating layer 125 and the insulating column 126 can be made of thesame material or different materials. For example, the insulating layer125 may be made of an inorganic material, and the insulating column 126may be made of an organic material, while they are manufactured indifferent processes. Alternatively the insulating layer 125 and theinsulating column 126 are both made of organic materials, and they aremanufactured in different processes or in the same process. In someembodiments, the insulating layer 125 and the insulating column 126 aremade of the same material. However, the present disclosure is notlimited to this. In FIG. 6, the elements that are the same as or similarto those in the aforementioned embodiments will have the same or similarreference numerals, and their description will be omitted. Theinsulating layer 125 may have a first maximum height H1, and theinsulating column 126 may have a fourth maximum height H4, wherein thesum of the first maximum height H1 and the fourth maximum height H4(that is, the maximum height of the insulator in the normal direction Nof the flexible substrate 11) is greater than the second maximum heightH2 of the first pad 111. In addition, in this embodiment, before beingpressed, the conductive particles 42 in the conductive adhesive 40 havean average particle size Ro, and the sum of the first maximum height H1and the fourth maximum height H4 is less than the sum of the secondmaximum height H2 and the average particle diameter Ro. In the processof pressing the flexible substrate 11 and the substrate 20, the amountof deformation of the conductive particle 42 between the first pad 111and the second pad 221 is 30%-70%, that is, after being pressed, thepressed particle diameter Rd of the conductive particle 42 is 30%-70% ofthe average particle diameter Ro. In some embodiments, the amount ofdeformation of the conductive particle 42 between the first pad 111 andthe second pad 221 may be between 30%-70%, 30%-60%, or 30%-50%. If theconductive particles 42 are excessively pressed, the conductiveparticles 42 will be damaged, and thus the amount of deformation of theconductive particle 42 should not be too large. Therefore, the sum ofthe first maximum height H1 and the fourth maximum height H4 may bebetween the second maximum height H2 and the sum of the second maximumheight H2 and 30%-70% of the average particle diameter Ro. However, thepresent disclosure is not limited to this.

It can be understood that this embodiment can achieve the effect of FIG.2 or FIG. 5 of the aforementioned embodiments, and thus a detaileddescription for the repeated portion is deemed unnecessary.

FIG. 7 is a partial cross-sectional view of an electronic deviceaccording to another embodiment of the present disclosure. Theelectronic device of this embodiment is similar to that disclosed inFIG. 3 or FIG. 5, except for the following differences.

In this embodiment, the insulator includes an insulating layer 127similar to that shown in FIG. 3 and an insulating column 128 similar tothat shown in FIG. 5. The insulating layer 127 is disposed on all of thesurface 110 between two adjacent first pads 111 and on the two sidesurfaces 1112, 1113 of the first pad 111. The insulating column 128 isarranged on the insulating layer 127 and between two adjacent first pads111. The conductive adhesive 40 is disposed on the insulating layer 127,the insulating columns 128 and first pads 111, and the conductiveadhesive 40 is disposed between the flexible circuit structure 10 andthe substrate 20, wherein the binder 41 in the conductive adhesive 40can be adhered to the insulating layer 127, the insulating column 128,and the substrate 20, respectively, and the conductive particles 42 inthe conductive adhesive 40 can be electrically connected to the firstpad 111 and the second pad 221. However, the present disclosure is notlimited to this. In some embodiments, the insulating layer 127 and theinsulating column 128 may be manufactured in the same process. In someembodiments, the insulating layer 127 and the insulating column 128 maybe manufactured in different processes. The insulating layer 127 and theinsulating column 128 may be made of the same material or differentmaterials. For example, the insulating layer 127 may be made of aninorganic material, and the insulating column 128 may be made of anorganic material, while they are manufactured in different processes.Alternatively, the insulating layer 127 and the insulating column 128are both made of organic materials, and they are manufactured indifferent processes or the same process. In some embodiments, theinsulating layer 127 and the insulating column 128 are made of the samematerial. However, the present disclosure is not limited to this. InFIG. 7, elements that are the same as or similar to those in theaforementioned embodiments will be given the same or similar referencenumerals, and their description will be omitted.

It can be understood that this embodiment can achieve the effect of FIG.3 or FIG. 5 of the aforementioned embodiments, and thus a detaileddescription for the repeated portion is deemed unnecessary.

The aforementioned embodiments describe in detail the connection of theflexible circuit structure 10 to the substrate 20 and the circuit board30, but the present disclosure is not limited thereto. Any electroniccomponent that transmits signals through the pads can be connected withthe flexible circuit structure 10 of the present disclosure for signaltransmission.

Although the present disclosure has been explained in relation to itsembodiment, it is to be understood that many other possiblemodifications and variations can be made without departing from thespirit and scope of the disclosure as hereinafter claimed.

What is claimed is:
 1. An electronic device, comprising: a flexiblecircuit structure, including: a flexible substrate having a surface onwhich a plurality of pads are disposed; and an insulator disposed on theflexible substrate and between two adjacent pads of the plurality ofpads.
 2. The electronic device of claim 1, wherein the insulatorincludes an insulating layer disposed between the two adjacent pads ofthe plurality of pads.
 3. The electronic device of claim 2, wherein theinsulating layer has a first maximum height in a normal direction of theflexible substrate, and one of the plurality of pads has a secondmaximum height in the normal direction of the flexible substrate, wherethe first maximum height is less than or equal to the second maximumheight.
 4. The electronic device of claim 2, further comprising aconductive adhesive disposed between the flexible circuit structure anda substrate, wherein an adhering strength of the conductive adhesive tothe insulating layer is better than that of the conductive adhesive tothe flexible substrate.
 5. The electronic device of claim 2, wherein oneof the plurality of pads includes a contact surface and two sidesurfaces, and the contact surface is provided between the two sidesurfaces and connected with the two side surfaces, where the insulatinglayer is disposed on at least one side surface of the two side surfacesof the plurality of pads.
 6. The electronic device of claim 5, whereinthe insulating layer has a first maximum height in a normal direction ofthe flexible substrate, and the one of the plurality of pads has asecond maximum height in the normal direction of the flexible substrate,where the first maximum height is less than or equal to the secondmaximum height.
 7. The electronic device of claim 6, further comprisinga conductive adhesive disposed between the flexible circuit structureand a substrate, wherein an adhering strength of the conductive adhesiveto the insulating layer is better than that of the conductive adhesiveto the flexible substrate.
 8. The electronic device of claim 2, whereinthe insulator further includes an insulating column.
 9. The electronicdevice of claim 8, wherein the insulating layer has a first maximumheight in a normal direction of the flexible substrate, the insulatingcolumn has a fourth maximum height in the normal direction of theflexible substrate, and one of the plurality of pads has a secondmaximum height in the normal direction of the flexible substrate, wherea sum of the first maximum height and the fourth maximum height isgreater than the second maximum height.
 10. The electronic device ofclaim 9, further comprising a conductive adhesive disposed between theflexible circuit structure and a substrate, wherein the conductiveadhesive includes a plurality of conductive particles having an averageparticle diameter, and the sum of the first maximum height and thefourth maximum height is less than a sum of the second maximum heightand the average particle diameter.
 11. The electronic device of claim10, wherein the sum of the first maximum height and the fourth maximumheight is between the second maximum height and a sum of the secondmaximum height and 30% to 70% of the average particle diameter.
 12. Theelectronic device of claim 8, wherein one of the plurality of padsincludes a contact surface and two side surfaces, and the contactsurface is provided between the two side surfaces and connected to thetwo side surfaces, where the insulating layer is disposed on at leastone side surface of the two side surfaces of the one of the plurality ofpads.
 13. The electronic device of claim 12, wherein the insulatinglayer has a first maximum height in a normal direction of the flexiblesubstrate, the insulating column has a fourth maximum height in thenormal direction of the flexible substrate, and the one of the pluralityof pads has a second maximum height in the normal direction of theflexible substrate, where a sum of the first maximum height and thefourth maximum height is greater than the second maximum height.
 14. Theelectronic device of claim 3, wherein the first maximum height of theinsulating layer is between 0.1 micrometer and 10 micrometer.
 15. Theelectronic device of claim 1, wherein the insulator includes aninsulating column disposed on the surface of the flexible substrate andbetween the two adjacent pads of the plurality of pads.
 16. Theelectronic device of claim 15, further comprising a conductive adhesivedisposed between the flexible circuit structure and a substrate, whereinan adhering strength of the conductive adhesive to the insulating columnis better than that of the conductive adhesive to the flexiblesubstrate.
 17. The electronic device of claim 15, wherein the insulatingcolumn has a third maximum height in a normal direction of the flexiblesubstrate, and one of the plurality of pads has a second maximum heightin the normal direction of the flexible substrate, where the thirdmaximum height is less than or equal to the second maximum height. 18.The electronic device of claim 15, wherein the insulating column has athird maximum height in a normal direction of the flexible substrate,and one of the plurality of pads has a second maximum height in thenormal direction of the flexible substrate, where the third maximumheight is greater than the second maximum height.
 19. The electronicdevice of claim 18, further comprising a conductive adhesive disposedbetween the flexible circuit structure and a substrate, and theconductive adhesive includes a plurality of conductive particles havingan average particle diameter, wherein the third maximum height is lessthan a sum of the second maximum height and the average particlediameter.
 20. The electronic device of claim 19, wherein the thirdmaximum height is less than or equal to a sum of the second maximumheight and 30% to 70% of the average particle diameter.